The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Dec. 17, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 24/19 (2013.01); H01L 24/25 (2013.01); H05K 1/185 (2013.01); H05K 3/4697 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92244 (2013.01); H05K 2201/068 (2013.01); Y10T 29/49139 (2015.01); Y10T 156/10 (2015.01);
Abstract
The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion.