The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Oct. 23, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Seung Eun Lee, Sungnam, KR;

Yul Kyo Chung, Yongin, KR;

Yee Na Shin, Suwon, KR;

Doo Hwan Lee, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/12042 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/1469 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49139 (2015.01);
Abstract

Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.


Find Patent Forward Citations

Loading…