The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

May. 30, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Eun Lee, Seongnam-si, KR;

Yee Na Shin, Suwon-si, KR;

Yul Kyo Chung, Yongin-si, KR;

Doo Hwan Lee, Daejeon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/8203 (2013.01); H01L 2924/3512 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.


Find Patent Forward Citations

Loading…