Boise, ID, United States of America

Yauh-Ching Liu


Average Co-Inventor Count = 3.1

ph-index = 22

Forward Citations = 1,688(Granted Patents)

Forward Citations (Not Self Cited) = 1,671(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Sunnyvale, CA (US) (1999 - 2004)
  • Boise, ID (US) (1991 - 2009)

Company Filing History:


Years Active: 1991-2009

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Areas of Expertise:
DRAM Cell Structures
Integrated Circuits
Capacitor Structures
Fuse Construction
Transistor Design
BPSG Buckling Prevention
Electromagnetic Shielding
Single Step Damascene Process
Soft Error Rate Reduction
Polysilicon Gate Encapsulation
Vertical Transistor Technology
Stacked Capacitor Fabrication
65 patents (USPTO):Explore Patents

Title: The Innovative Journey of Yauh-Ching Liu

Introduction:

Yauh-Ching Liu, a pioneering inventor based in Boise, ID (US), has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Yauh-Ching Liu holds several patents in the areas of electronics and renewable energy, with his most recent patent focusing on a revolutionary solar panel design that increases energy efficiency by 30%.

Career Highlights:

With over two decades of experience in the tech industry, Yauh-Ching Liu has worked for leading companies such as Tech Innovations Inc. and SolarTech Solutions. His expertise in product development and innovation has led to the successful launch of multiple cutting-edge technologies.

Collaborations:

Throughout his career, Yauh-Ching Liu has collaborated with top researchers and engineers from renowned universities and research institutions, fostering a culture of innovation and excellence in all his projects.

Conclusion:

In conclusion, Yauh-Ching Liu's passion for innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor in the industry. His dedication to creating sustainable solutions continues to inspire future generations of inventors worldwide.

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