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For the Inventor, By the Inventor

Kawasaki, Japan

Yasumasa Iwata

USPTO Granted Patents = 16

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Kanagawa, JP (2012 - 2017)
  • Kawasaki, JP (2012 - 2020)

Company Filing History:

goldMedal16 out of 1,233 
 
Tokyo Ohka Kogyo Co., Ltd.
 patents

Years Active: 2012-2020

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16 patents (USPTO):Explore Patents
1. 10607876 - Method for processing mold material and method for manufacturing structural body (2020-03-31),
2. 9881829 - Adhesive composition, laminate, and stripping method (2018-01-30),
3. 9682541 - Bonding method (2017-06-20),
4. 9627235 - Supporting member separation method (2017-04-18),
5. 9607875 - Adhesive composition, laminate, and stripping method (2017-03-28),
6. 9484238 - Attachment method (2016-11-01),
7. 9129999 - Treatment device, treatment method, and surface treatment jig (2015-09-08),
8. 8882096 - Perforated support plate (2014-11-11),
9. 8449691 - Liquid solvent abutment unit (2013-05-28),
10. 8377256 - Stripping device and stripping method (2013-02-19),
11. 8371317 - Surface treatment apparatus (2013-02-12),
12. 8302651 - Stripping device and stripping method (2012-11-06),
13. 8297331 - Separating apparatus and separating method (2012-10-30),
14. 8186410 - Separating device (2012-05-29),
15. 8181660 - Treatment liquid permeation unit and treating apparatus (2012-05-22),

Title: Yasumasa Iwata: Innovator in Mold Processing and Adhesive Technologies

Introduction

Yasumasa Iwata is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the fields of mold processing and adhesive technologies. With a total of 16 patents to his name, Iwata's work has had a considerable impact on manufacturing processes.

Latest Patents

Iwata's latest patents include a "Method for processing mold material" and an "Adhesive composition, laminate, and stripping method." The first patent describes a method for processing a mold material that involves a heating step to discharge gas from the mold material layer. The second patent focuses on an adhesive composition designed for temporarily attaching a substrate to a support plate, which includes a thermoplastic resin and a release agent.

Career Highlights

Iwata is currently employed at Tokyo Ohka Kogyo Co., Ltd., where he continues to innovate and develop new technologies. His expertise in mold processing and adhesive applications has positioned him as a key figure in his field.

Collaborations

Iwata has collaborated with notable colleagues such as Akihiko Nakamura and Yoshihiro Inao, contributing to various projects and advancements in their respective areas of expertise.

Conclusion

Yasumasa Iwata's contributions to innovation in mold processing and adhesive technologies highlight his importance as an inventor. His work continues to influence the manufacturing industry and inspire future developments.

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