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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9627235 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

Apr. 28, 2015

Supporting member separation method

Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;

Inventors:

Yasumasa Iwata, Kawasaki, JP;

Yoshihiro Inao, Kawasaki, JP;

Akihiko Nakamura, Kawasaki, JP;

Shinji Takase, Kawasaki, JP;

Takahiro Yoshioka, Kawasaki, JP;

Assignee:

TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

Mark A Osele

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); B32B 37/02 (2006.01); B32B 38/10 (2006.01); B32B 38/18 (2006.01); B32B 37/26 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B32B 37/02 (2013.01); B32B 38/10 (2013.01); B32B 38/1858 (2013.01); B32B 43/006 (2013.01); H01L 21/6836 (2013.01); B32B 2037/268 (2013.01); B32B 2307/202 (2013.01); B32B 2310/0825 (2013.01); B32B 2310/0843 (2013.01); B32B 2311/00 (2013.01); B32B 2313/00 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68386 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1189 (2015.01); Y10T 156/1917 (2015.01);
Abstract

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

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