The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
May. 05, 2014
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Inventors:
Yasushi Fujii, Kawasaki, JP;
Akihiko Nakamura, Kawasaki, JP;
Yasumasa Iwata, Kawasaki, JP;
Shingo Ishida, Kawasaki, JP;
Assignee:
TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/568 (2013.01); H01L 24/96 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.