Tokyo Ohka Kogyo Co., Ltd.

Yasumasa Iwata

Akihiko Nakamura

Yoshihiro Inao

Atsushi Miyanari

Takahiro Yoshioka

Hirofumi Imai

Atsushi Kubo

Kimihiro Nakada

Shingo Ishida

Koki Tamura

Yasushi Fujii

Shigeru Kato

Junichi Katsuragawa

Satoshi Kobari

Shinji Takase

A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

Method for processing mold material and method for manufacturing structural body

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

Adhesive composition, laminate, and stripping method

A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Bonding method

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Supporting member separation method

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

An attachment method including an overlapping step of overlapping a support plate over a substrate under a reduced pressure environment; a temporary fixing step of temporarily fixing the support plate to the substrate; and an attaching step of attaching the support plate to the substrate under a reduced pressure environment. The method further includes, prior to the overlapping step, at least one of a first heating step in which heating is performed under an atmospheric pressure environment and a second heating step in which heating is performed under a reduced pressure environment.

Attachment method

The treatment deviceof the present invention is a treatment device for carrying out treatment to a treatment objectwhose treatment surface includes a second treatment surfaceand a first treatment surfacesurrounding the second treatment surface, the treatment device including: a table sectionfor placing the treatment objectthereon; and a first feeding sectionfor feeding a first treatment liquid to an approximate boundary between the first and the second treatment surfacesand a second feeding sectionfor feeding a second treatment liquid to the second treatment surface. Thus, the present invention provides a treatment device, a treatment method, and a surface treatment jig, each of the treatment device and the treatment method being capable of carrying out independent treatments to a treatment surface and an exposed surface surrounding the treatment surface, respectively.

Treatment device, treatment method, and surface treatment jig

To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

Perforated support plate

In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.

Liquid solvent abutment unit

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Stripping device and stripping method

A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface.

Surface treatment apparatus

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.

Separating apparatus and separating method

A separating device according to the present invention separates a support plate () from a substrate () of a laminate () including the substrate () and the support plate () bonded to each other. The separating device includes: a first storing section () for storing the laminate (); a plurality of first processing sections () for reducing adhesive force of an adhesive () applied between the substrate () and the support plate (); and a first carrying section () which is capable of moving in the first direction and carries the laminate () from the first storing section () to the first processing section () while holding the laminate (). With the first carrying section (), it is possible to provide a separating device () which moves straightly so as to carry the laminate (). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.

Separating device

A treatment liquid permeation unit comprises: at least one vibration unit; and a vibration transmission unit for transmitting a vibration from the vibration unit. The vibration transmission unit is positioned between an adhesive with which a wafer is combined to a supporting plate or an adhesive adhered to a surface of the wafer and the vibration unit. A vibration from the vibration unit is transmitted via the vibration transmission unit. This promotes the treatment liquid for dissolving the adhesive to permeate the adhesive to which the treatment liquid is supplied. Therefore, the treatment liquid can more uniformly permeate the adhesive in a shorter time. This allows the treatment liquid for dissolving the adhesive to permeate the adhesive with which the wafer is combined to the supporting plate or to permeate the adhesive adhered to the surface of the wafer in a shorter time.

Growing community of inventors

Kawasaki, Japan

Yasumasa Iwata