The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Dec. 10, 2014
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Hirofumi Imai, Kawasaki, JP;
Atsushi Kubo, Kawasaki, JP;
Takahiro Yoshioka, Kawasaki, JP;
Kimihiro Nakada, Kawasaki, JP;
Shigeru Kato, Kawasaki, JP;
Yasumasa Iwata, Kawasaki, JP;
TOKOY OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;
Abstract
A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.