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For the Inventor, By the Inventor

Tokyo, Japan

Yasumasa Hiroo

This inventor holds 15 USPTO granted patents and 4 published patent applications and 2 EPO patents. Top assignee: Ebara Corporation. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasumasa Hiroo. Retrieved from https://idiyas.com/inventor/yasumasa-hiroo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 93.3

 

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 97(Granted Patents)


Location History:

  • Kanagawa, JP (2004 - 2007)
  • Tokyo, JP (2010 - 2024)

Company Filing History:

goldMedal15 out of 2,576 
 
Ebara Corporation
 patents

Years Active: 2004-2026

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15 patents (USPTO):Explore Patents
1. 12654278 - Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece (2026-06-16),
2. 12420378 - Substrate processing apparatus and method for controlling dressing of polishing member (2025-09-23),
3. 11945075 - Polishing apparatus and polishing member dressing method (2024-04-02),
4. 11458589 - Polishing apparatus and polishing member dressing method (2022-10-04),
5. 10828747 - Substrate polishing apparatus and method (2020-11-10),
6. 9440327 - Polishing apparatus and polishing method (2016-09-13),
7. 9437507 - Method of correcting film thickness measurement value, film thickness corrector and eddy current sensor (2016-09-06),
8. 8398456 - Polishing method, polishing apparatus and method of monitoring a substrate (2013-03-19),
9. 8246417 - Polishing apparatus and polishing method (2012-08-21),
10. 8112169 - Polishing apparatus and polishing method (2012-02-07),
11. 8078419 - Polishing monitoring method and polishing apparatus (2011-12-13),
12. 7822500 - Polishing apparatus and polishing method (2010-10-26),
13. 7313452 - Substrate transfer controlling apparatus and substrate transferring method (2007-12-25),
14. 7072730 - Substrate transfer controlling apparatus and substrate transferring method (2006-07-04),
15. 6772029 - Wafer transfer control apparatus and method for transferring wafer (2004-08-03),

Title: Yasumasa Hiroo: Innovator in Substrate Processing Technology

Introduction

Yasumasa Hiroo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate processing technology, holding a total of 15 patents. His innovative work focuses on enhancing the efficiency and effectiveness of polishing apparatuses.

Latest Patents

Hiroo's latest patents include a substrate processing apparatus and a method for controlling the dressing of polishing members. This apparatus polishes a substrate by sliding it on a polishing member, featuring a dresser that adjusts the swing speed across various scanning areas. Additionally, it includes a height detection section that measures the surface height of the polishing member, generating a pad profile. Another notable patent involves a polishing apparatus and a polishing member dressing method, which allows for the adjustment of swing speed in scanning areas and the calculation of a height profile predicted value based on a dress model matrix.

Career Highlights

Yasumasa Hiroo has dedicated his career to advancing substrate processing technologies. His work at Ebara Corporation has positioned him as a key figure in the industry, where he continues to innovate and develop new solutions for polishing processes.

Collaborations

Hiroo collaborates with talented coworkers, including Yoichi Kobayashi and Tsuyoshi Ohashi, to further enhance the capabilities of their technologies.

Conclusion

Yasumasa Hiroo's contributions to substrate processing technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in polishing processes, making him a valuable asset to Ebara Corporation and the industry as a whole.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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