The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Oct. 09, 2008
Yoichi Kobayashi, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Yasumasa Hiroo, Tokyo, JP;
Akihiko Ogawa, Tokyo, JP;
Shinrou Ohta, Tokyo, JP;
Yoichi Kobayashi, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Yasumasa Hiroo, Tokyo, JP;
Akihiko Ogawa, Tokyo, JP;
Shinrou Ohta, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A method monitors a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.