Company Filing History:
12 out of 2,510 
2 out of 52,735 
1 out of 3,509 
Years Active: 2007-2015
Title: Innovations of Shinrou Ohta
Introduction
Shinrou Ohta is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of polishing technology, holding a total of 12 patents. His work focuses on methods and apparatuses that enhance the efficiency and accuracy of polishing processes.
Latest Patents
Ohta's latest patents include a polishing monitoring method and a polishing endpoint detection method. The polishing monitoring method utilizes an eddy current sensor to monitor changes in the thickness of a conductive film during polishing. This method involves acquiring output signals from the sensor, defining these signals as coordinates, and determining the curvature and angle of inclination to monitor thickness changes effectively. The polishing endpoint detection method provides a way to accurately determine the endpoint of polishing by analyzing changes in the polishing rate through reflected light and spectral profiles.
Career Highlights
Throughout his career, Ohta has worked with notable companies such as Ebara Corporation and Toshiba Corporation. His experience in these organizations has allowed him to develop innovative solutions that address complex challenges in polishing technology.
Collaborations
Ohta has collaborated with esteemed colleagues, including Yoichi Kobayashi and Noburu Shimizu. Their combined expertise has contributed to advancements in the field and the successful development of Ohta's patented technologies.
Conclusion
Shinrou Ohta's contributions to polishing technology through his innovative patents demonstrate his expertise and commitment to advancing the industry. His work continues to influence the field and inspire future innovations.