The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
May. 13, 2009
Shinrou Ohta, Tokyo, JP;
Mitsuo Tada, Tokyo, JP;
Noburu Shimizu, Tokyo, JP;
Yoichi Kobayashi, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Eisaku Hayashi, Kanagawa, JP;
Hiromitsu Watanabe, Tokyo, JP;
Tatsuya Kohama, Tokyo, JP;
Itsuki Kobata, Tokyo, JP;
Shinrou Ohta, Tokyo, JP;
Mitsuo Tada, Tokyo, JP;
Noburu Shimizu, Tokyo, JP;
Yoichi Kobayashi, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Eisaku Hayashi, Kanagawa, JP;
Hiromitsu Watanabe, Tokyo, JP;
Tatsuya Kohama, Tokyo, JP;
Itsuki Kobata, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.