Location History:
- Osaka, JP (2002 - 2005)
- Fujisawa, JP (2004 - 2007)
- Ohta-ku, JP (2009)
- Tokyo, JP (2006 - 2024)
Company Filing History:
Years Active: 2002-2025
Areas of Expertise:
Title: Innovations of Itsuki Kobata in Substrate Processing
Introduction
Itsuki Kobata is a distinguished inventor based in Tokyo, Japan, known for his groundbreaking contributions to polishing and substrate processing technology. With an impressive portfolio of 40 patents, Kobata has significantly advanced the field through innovative methodologies and apparatus designs.
Latest Patents
Among his latest patents are an "Apparatus for Polishing" and a "Substrate Processing Method and Substrate Processing Apparatus." The apparatus includes a table to support a polishing pad, a polishing head for holding substrates, and a specialized polishing solution supply device. This device features multiple supply ports strategically arranged to optimize flow rate distribution as it interacts with the polishing pad. His substrate processing method further enhances substrate quality by preventing corrosion through the use of a liquid with reduced oxygen concentration, utilizing an inert gas to enhance processing efficiency.
Career Highlights
Kobata's career has been marked by significant roles in reputable companies such as Ebara Corporation. His expertise in polishing and substrate processing has led to substantial advancements in manufacturing and materials science, positioning him as a renowned figure in technological innovation.
Collaborations
Throughout his career, Kobata has collaborated with notable professionals in the industry, including Mitsuhiko Shirakashi and Takayuki Saito. These collaborations have been pivotal in enhancing the efficacy and application of his patented technologies in the real world.
Conclusion
Itsuki Kobata's impactful innovations in polishing apparatuses and substrate processing methods have established him as a leading inventor in his field. His continued commitment to advancing technology ensures that his work will influence future developments in substrate handling and processing industries.