The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Jan. 13, 2021
Ebara Corporation, Tokyo, JP;
Itsuki Kobata, Tokyo, JP;
Hozumi Yasuda, Tokyo, JP;
Akio Yanai, Tokyo, JP;
Nobuyuki Takahashi, Tokyo, JP;
Takamasa Nakamura, Tokyo, JP;
Keisuke Sakata, Tokyo, JP;
Nobuyuki Takada, Tokyo, JP;
Yuji Yagi, Tokyo, JP;
Yasuhiro Takada, Tokyo, JP;
Katsuhide Watanabe, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.