Location History:
- Yokohama, JP (2006)
- Tokyo, JP (2004 - 2024)
Company Filing History:
Years Active: 2004-2024
Title: Innovations by Yuji Yagi in Polishing Technology
Introduction
Yuji Yagi is a prominent inventor based in Tokyo, Japan, known for his significant contributions to polishing technology. With a total of five patents to his name, Yagi has developed innovative systems that enhance the precision and efficiency of substrate polishing processes.
Latest Patents
Among his latest patents is the "Polishing head system and polishing apparatus." This invention features a polishing head equipped with multiple piezoelectric elements that apply precise pressing forces to workpieces, such as wafers and substrates. The system includes an operation controller that determines the necessary voltages for the piezoelectric elements, allowing for meticulous control over the film-thickness profile of the workpiece.
Another notable patent is the "Substrate polishing system, substrate polishing method, and substrate polishing apparatus." This invention comprises two substrate polishing apparatuses that utilize a film thickness sensor to measure the thickness of the layer being polished. The first apparatus calculates a first offset value based on the sensor's output when the underlayer is exposed versus when the substrate is absent. The second apparatus stores this offset value and corrects the sensor's output accordingly, ensuring that the polishing process is accurately controlled until the target film thickness is achieved.
Career Highlights
Yuji Yagi has worked with esteemed companies such as Ebara Corporation and Hitachi, Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in polishing technology.
Collaborations
Yagi has collaborated with notable coworkers, including Motoaki Hirabayashi and Itsuki Kobata. Their combined expertise has fostered innovation in the field of substrate polishing.
Conclusion
Yuji Yagi's work in polishing technology exemplifies the impact of innovative thinking in engineering. His patents reflect a commitment to enhancing precision in manufacturing processes, making significant strides in the industry.