Ebara Corporation

Hitachi, Ltd.

Yuji Yagi

Nobuyuki Takahashi

Hozumi Yasuda

Katsuhide Watanabe

Itsuki Kobata

Nobuyuki Takada

Motoaki Hirabayashi

Koichi Takeda

Yuta Suzuki

Taro Takahashi

Takamasa Nakamura

Akihiko Ogawa

Shinpei Tokunaga

Keisuke Sakata

Yasuhiro Takada

Shigeyuki Furuya

Akio Yanai

A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.

Polishing head system and polishing apparatus

A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Substrate polishing system, substrate polishing method and substrate polishing apparatus

One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Polishing machine and a polishing method for a substrate

In one embodiment of the invention, a disk storage accessing system for enabling a plurality of computers to share and access a plurality of disk storages comprises a plurality of computers that refer to the disk storages. Each of the computers includes a counting module for counting a frequency of accesses to each of the disk storages, and a module for receiving an access path change command to change access paths for the computer to access a different disk storage according to the command. The system further comprises an instructing module for collecting and totaling a frequency of accesses to each disk storage, and for instructing the receiving module of a computer that accesses the copy source disk storage after receiving a report of copy completion, to change access paths so as to access a target disk storage instead of the copy source disk storage.

Disk storage accessing system and method for changing access path to storage devices

In one embodiment of the invention, a disk storage accessing system for enabling a plurality of computers to share and access a plurality of disk storage comprises a plurality of computers that refer to the disk storage. Each of the computers includes a counting module for counting a frequency of access to each of the disk storage, and a module for receiving an access path change command to change access paths for the computer to access a different disk storage according to the command. The system further comprises an instructing module for collecting and totaling a frequency of accesses to each disk storage, as counted by the counting module of each of the computers, as well as instructing a particular disk storage as a copy source disk storage to copy content in the copy source disk storage into one or more other disk storage as one or more target disk storage when the totaled access frequency is higher than a predetermined value, and for instructing the receiving module of a computer that accesses the copy source disk storage after receiving a report of copy completion, to change access paths so as to access a target disk storage instead of the copy source disk storage.

Growing community of inventors

Tokyo, Japan

Yuji Yagi