The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2022

Filed:

Feb. 11, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Itsuki Kobata, Tokyo, JP;

Katsuhide Watanabe, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Yuji Yagi, Tokyo, JP;

Nobuyuki Takahashi, Tokyo, JP;

Koichi Takeda, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/04 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/042 (2013.01); B24B 37/20 (2013.01);
Abstract

One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.


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