Ebara Corporation

Other

Itsuki Kobata

Mitsuhiko Shirakashi

Hozumi Yasuda

Takayuki Saito

Yasushi Toma

Kuniaki Yamaguchi

Toshio Mizuno

Masayuki Kumekawa

Nobuyuki Takahashi

Katsuhide Watanabe

Tsukuru Suzuki

Yuzo Mori

Kaoru Yamada

Yuji Makita

Osamu Nabeya

Mitsuru Miyazaki

Yoichi Kobayashi

Toru Maruyama

Kazuto Hirokawa

Keita Yagi

Takuya Inoue

Yoichi Shiokawa

Naoki Toyomura

Toshifumi Kimba

Akira Fukunaga

Tadakazu Sone

Masaki Kinoshita

Ikutaro Noji

Katsutoshi Ono

Takeshi Iizumi

Yutaka Wada

Hisanori Matsuo

Nobuyuki Takada

Ryuichi Kosuge

Hiromitsu Watanabe

Yuji Yagi

Takashi Yamazaki

Yosuke Himori

Masayoshi Ito

Takuya Moriura

Hirokuni Hiyama

Koichi Takeda

Tomoatsu Ishibashi

Taro Takahashi

Noburu Shimizu

Kaori Yoshida

Hiroshi Sotozaki

Mitsuo Tada

Koichi Fukaya

Shinrou Ohta

Tatsuya Kohama

Takamasa Nakamura

Suguru Sakugawa

Tomohiko Takeuchi

Eisaku Hayashi

Zhongxin Wen

Keisuke Sakata

Akira Kodera

Atsuo Katagiri

Erina Baba

Tetsuya Terada

Akio Yanai

Yasuhiro Takada

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

Substrate processing apparatus

There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

Apparatus for polishing, processing system, and method of polishing

A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.

Substrate processing method and substrate processing apparatus

An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Substrate processing apparatus, substrate processing system, and substrate processing method

To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

Cleaning module, substrate processing apparatus including cleaning module, and cleaning method

A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.

Polishing head system and polishing apparatus

An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

Polishing device, polishing method, and recording medium for recording program for determining supply position of polishing liquid

There is provided an apparatus for polishing, comprising a polishing table configured to support and rotate a polishing pad; a holder configured to hold an object and press the object against the polishing pad; a polishing solution supply device provided with a contact member and configured to supply a polishing solution to an opening in a bottom face of the contact member in a state that the contact member comes into contact with or is adjacent to the polishing pad, thereby spreading the polishing solution on the polishing pad, the polishing solution supply device causing at least part of used polishing solution returned by rotation of the polishing pad to be dammed up by the contact member and setting the contact member either in a direction of keeping the dammed up polishing solution on the polishing pad or in a direction of discharging the dammed up polishing solution, according to an angle of the polishing solution supply device with respect to a radial direction of the polishing pad; an arm linked with the polishing solution supply device; a rotating mechanism configured to rotate the polishing solution supply device with respect to the arm; and a controller configured to control the rotating mechanism to change the angle of the polishing solution supply device with respect to the radial direction of the polishing pad and thereby control a discharge amount of the polishing solution by the contact member of the polishing solution supply device.

Apparatus for polishing and method of polishing

A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.

Polishing apparatus

A polishing head system capable of precisely controlling a pressing force of a retainer member, such as a retainer ring, against a polishing pad. The polishing head system includes: a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and piezoelectric elements coupled to the retainer member; and a drive-voltage application device configured to apply voltages independently to the piezoelectric elements.

One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Polishing machine and a polishing method for a substrate

A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

Polishing method and polishing apparatus

Planarization is performed on heterogeneous films with high accuracy. According to one embodiment, a method for processing a substrate is provided. The substrate is formed of an insulating film layer where a groove is formed, a barrier metal layer, and a wiring metal layer in order from a bottom in at least a part of a region. The method includes (3) while the wiring metal layer, the barrier metal layer, and the insulating film layer are exposed to the surface of the substrate: a step of bringing the surface of the substrate into contact with a catalyst; a step of supplying a process liquid between the catalyst and the surface of the substrate; and a step of flowing a current between the catalyst and the surface of the substrate.

Method for processing substrate and substrate processing apparatus

Growing community of inventors

Tokyo, Japan

Itsuki Kobata