The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Mar. 12, 2015
Ebara Corporation, Tokyo, JP;
Akira Nakamura, Tokyo, JP;
Hiroaki Shibue, Tokyo, JP;
Yasumasa Hiroo, Tokyo, JP;
Hiroshi Ota, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Mitsuo Tada, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S), computing a correction value (ΔX, ΔY) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S).