The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2010

Filed:

Jun. 20, 2005
Applicants:

Yoichi Kobayashi, Tokyo, JP;

Yasumasa Hiroo, Tokyo, JP;

Tsuyoshi Ohashi, Tokyo, JP;

Inventors:

Yoichi Kobayashi, Tokyo, JP;

Yasumasa Hiroo, Tokyo, JP;

Tsuyoshi Ohashi, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 13/02 (2006.01); G06F 19/00 (2006.01); B24B 49/00 (2006.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing apparatus has a polishing table () having a polishing surface () and a top ring () for pressing a substrate against the polishing surface () while independently controlling pressing forces applied to a plurality of areas (C-C) on the substrate. The polishing apparatus has a sensor () for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit () for performing a predetermined arithmetic process on a signal from the sensor () to generate a monitor signal, and a controller () for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring () so that the monitor signal of the measurement point converges on the reference signal.


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