The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Nov. 11, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Yuki Watanabe, Tokyo, JP;

Yoichi Shiokawa, Tokyo, JP;

Yasumasa Hiroo, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 49/12 (2006.01); G01B 11/06 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/10 (2013.01); B24B 49/12 (2013.01); G01B 11/06 (2013.01);
Abstract

A polishing method capable of accurately determining a thickness of a polishing-target layer without being affected by noises is disclosed. The polishing method for polishing a polishing-target layer of a workpiece includes: rotating a polishing table supporting a polishing pad; polishing the polishing-target layer by pressing the workpiece against the polishing pad; irradiating the workpiece with light; receiving reflected light from the workpiece; measuring an intensity of the reflected light at each of wavelengths; generating a spectral waveform showing a relationship between the intensity and wavelength of the reflected light; performing a Fourier transform process on the spectral waveform to generate a frequency spectrum; moving a peak search range for the frequency spectrum according to a polishing time; determining a peak of the frequency spectrum within the peak search range; and determining a thickness of the polishing-target layer corresponding to the determined peak.


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