Yasuhiro Amano

Title: Yasuhiro Amano: Innovator in Semiconductor Technology

Introduction

Yasuhiro Amano is a prominent inventor based in Ibaraki, Japan, known for his significant contributions to semiconductor technology. With a total of eight patents to his name, Amano has made remarkable advancements in materials used for electronic applications.

Latest Patents

Among his latest innovations is a dicing die bond film that minimizes peeling electrification while maintaining excellent tackiness and workability. This film comprises a dicing film and a thermosetting type die bond film, which contains conductive particles. The volume resistivity of this thermosetting type die bond film ranges from 1×10^8 Ω·cm or more to 1×10^8 Ω·cm or less, with a tensile storage modulus at -20°C before thermal curing between 0.1 to 10 GPa. Another notable patent is a cleaning sheet designed for substrate processing apparatuses. This cleaning sheet features a microasperity shape with an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. The cleaning layer's substantial surface area is 150% or more of that of a silicon wafer mirror surface per a flat area of 1 mm².

Career Highlights

Yasuhiro Amano has worked with notable companies such as Nitto Denko Corporation and Nittok Denko Corporation, where he has honed his expertise in semiconductor materials and applications. His work has significantly impacted the efficiency and effectiveness of electronic devices.

Collaborations

Throughout his career, Amano has collaborated with talented individuals, including Yoshio Terada and Daisuke Uenda, contributing to various innovative projects in the semiconductor field.

Conclusion

Yasuhiro Amano's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in electronic materials and applications.