The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Nov. 05, 2013
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/78 (2006.01); C09J 7/02 (2006.01); C09J 9/02 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); C08K 7/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); C09J 7/0203 (2013.01); C09J 9/02 (2013.01); H01L 21/67132 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); C08K 7/00 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/293 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/3025 (2013.01); Y10T 428/25 (2015.01); Y10T 428/28 (2015.01); Y10T 428/2817 (2015.01);
Abstract
The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10Ω·cm or more and 1×10Ω·cm or less, and the tensile storage modulus of the thermosetting type die bond film at −20° C. before thermal curing is 0.1 to 10 GPa.