Ibaraki, Japan

Yuta Kimura


Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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4 patents (USPTO):Explore Patents

Title: Yuta Kimura: Innovator in Semiconductor Technology

Introduction

Yuta Kimura is a prominent inventor based in Ibaraki, Japan, known for his significant contributions to semiconductor technology. With a total of four patents to his name, Kimura has developed innovative solutions that enhance the performance and reliability of semiconductor devices.

Latest Patents

Among his latest patents, Kimura has introduced a film adhesive designed to prevent thermal effects on semiconductor wafers while minimizing warping. This film adhesive comprises a thermoplastic resin and electrically conductive particles, achieving an adhesion strength of 0.5 N/10 mm or more at 25°C. Additionally, he has developed a dicing tape that incorporates this film adhesive, as well as a method for manufacturing semiconductor devices. Another notable invention is the dicing die bond film, which exhibits excellent tackiness and workability while minimizing peeling electrification. This film includes a thermosetting type die bond film containing conductive particles, with specific resistivity and tensile storage modulus characteristics.

Career Highlights

Yuta Kimura is currently employed at Nitto Denko Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the field, particularly in the development of materials that enhance device performance.

Collaborations

Throughout his career, Kimura has collaborated with notable colleagues, including Yasushi Inoue and Takeshi Matsumura. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Yuta Kimura's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work not only addresses current challenges but also paves the way for future advancements in semiconductor manufacturing.

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