Nitto-denko Corporation

Yuta Kimura

Takeshi Matsumura

Yasushi Inoue

Yuki Sugo

Yasuhiro Amano

Miki Morita

The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25&#xb0; C. after the film adhesive is pasted to a mirror silicon wafer at 40&#xb0; C. of 0.5 N/10 mm or more.

Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1&#xd7;10&#x3a9;&#xb7;cm or more and 1&#xd7;10&#x3a9;&#xb7;cm or less, and the tensile storage modulus of the thermosetting type die bond film at &#x2212;20&#xb0; C. before thermal curing is 0.1 to 10 GPa.

Dicing die bond film

An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180&#xb0; C. or more.

Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device

An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120&#xb0; C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

Growing community of inventors

Ibaraki, Japan

Yuta Kimura