The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Feb. 29, 2008
Naohide Takamoto, Ibaraki, JP;
Sadahito Misumi, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Yasuhiro Amano, Ibaraki, JP;
Masami Oikawa, Kisarazu, JP;
Tsubasa Miki, Ibaraki, JP;
Naohide Takamoto, Ibaraki, JP;
Sadahito Misumi, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Yasuhiro Amano, Ibaraki, JP;
Masami Oikawa, Kisarazu, JP;
Tsubasa Miki, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.