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Naohide Takamoto

This inventor holds 49 USPTO granted patents and 42 published patent applications, primarily in Semiconductor Packaging. Top assignee: Nitto-Denko Corporation. Active years: 2009-2026.

USPTO Granted Patents = 49 (Patent Applications = 42)

% Patents Active = 20.4

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 79(Granted Patents)

Location History:

Ibaraki, JP (2009 - 2018)
Osaka, JP (2013 - 2019)

Company Filing History:

49 out of 3,946

Nitto-Denko Corporation

patents

Years Active: 2009-2026

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Areas of Expertise:

Semiconductor Packaging

Dicing Tape

Flip-Chip

Underfill Material

Protective Film

Manufacturing Process

Laminated Sheet

Thermally Releasable Sheet

Adhesive Sheet

Wafer Back Surface

Film Production

Reinforcing Sheet

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12742100 - Protective sheet, method for producing electronic component, and method for producing glass piece forming display surface of display apparatus (2026-09-22),

2. 10211083 - Film for flip chip type semiconductor back surface and its use (2019-02-19),

3. 10141217 - Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device (2018-11-27),

4. 10014235 - Underfill material, laminated sheet and method for producing semiconductor device (2018-07-03),

5. 9911683 - Film for back surface of flip-chip semiconductor (2018-03-06),

6. 9768050 - Film for semiconductor back surface and its use (2017-09-19),

7. 9761475 - Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production (2017-09-12),

8. 9679797 - Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device (2017-06-13),

9. 9620403 - Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device (2017-04-11),

10. 9478454 - Dicing tape-integrated film for semiconductor back surface (2016-10-25),

11. 9472439 - Reinforcing sheet and method for producing secondary mounted semiconductor device (2016-10-18),

12. 9368421 - Under-fill material and method for producing semiconductor device (2016-06-14),

13. 9362156 - Dicing tape-integrated film for semiconductor back surface (2016-06-07),

14. 9324616 - Method of manufacturing flip-chip type semiconductor device (2016-04-26),

15. 9293387 - Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device (2016-03-22),

Title: Naohide Takamoto - Innovative Inventor from Osaka

Introduction: Naohide Takamoto is a renowned inventor hailing from Osaka, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Naohide Takamoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach.

Career Highlights: With over two decades of experience in the innovation industry, Naohide Takamoto has worked with leading research institutions and companies to develop cutting-edge solutions that have revolutionized the way we interact with technology.

Collaborations: Throughout his career, Naohide Takamoto has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence in all his projects.

Conclusion: Naohide Takamoto's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

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