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Naohide Takamoto

USPTO Granted Patents = 48 (Patent Applications = 43)

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 76(Granted Patents)

Location History:

Ibaraki, JP (2009 - 2018)
Osaka, JP (2013 - 2019)

Company Filing History:

48 out of 3,871

Nitto-denko Corporation

Years Active: 2009-2019

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Areas of Expertise:

Flip Chip Technology

Semiconductor Manufacturing

Dicing Tape Integration

Underfill Materials

Protective Films

Thermally Releasable Sheets

Epoxy Resin Composition

Laminated Films

Adhesive Sheets

Reinforcing Sheets

Thermosetting Die Bonding

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10211083 - Film for flip chip type semiconductor back surface and its use (2019-02-19),

2. 10141217 - Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device (2018-11-27),

3. 10014235 - Underfill material, laminated sheet and method for producing semiconductor device (2018-07-03),

4. 9911683 - Film for back surface of flip-chip semiconductor (2018-03-06),

5. 9768050 - Film for semiconductor back surface and its use (2017-09-19),

6. 9761475 - Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production (2017-09-12),

7. 9679797 - Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device (2017-06-13),

8. 9620403 - Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device (2017-04-11),

9. 9478454 - Dicing tape-integrated film for semiconductor back surface (2016-10-25),

10. 9472439 - Reinforcing sheet and method for producing secondary mounted semiconductor device (2016-10-18),

11. 9368421 - Under-fill material and method for producing semiconductor device (2016-06-14),

12. 9362156 - Dicing tape-integrated film for semiconductor back surface (2016-06-07),

13. 9324616 - Method of manufacturing flip-chip type semiconductor device (2016-04-26),

14. 9293387 - Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device (2016-03-22),

15. 9279064 - Manufacturing semiconductor device with film for forming protective layer (2016-03-08),

Title: Naohide Takamoto - Innovative Inventor from Osaka

Introduction: Naohide Takamoto is a renowned inventor hailing from Osaka, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Naohide Takamoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach.

Career Highlights: With over two decades of experience in the innovation industry, Naohide Takamoto has worked with leading research institutions and companies to develop cutting-edge solutions that have revolutionized the way we interact with technology.

Collaborations: Throughout his career, Naohide Takamoto has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence in all his projects.

Conclusion: Naohide Takamoto's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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