The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Feb. 18, 2015
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01); H01L 21/04 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); C09J 165/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 37/1284 (2013.01); B32B 38/0004 (2013.01); B32B 38/10 (2013.01); C09J 7/02 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3164 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); B32B 2405/00 (2013.01); B32B 2457/14 (2013.01); C09J 165/00 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); H01L 23/3114 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/83 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/5448 (2013.01); H01L 2223/54406 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81095 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/0001 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); Y10T 156/1052 (2015.01); Y10T 156/1064 (2015.01); Y10T 156/1075 (2015.01); Y10T 156/1077 (2015.01); Y10T 156/1082 (2015.01); Y10T 156/1093 (2015.01); Y10T 428/1471 (2015.01); Y10T 428/1476 (2015.01); Y10T 428/1495 (2015.01); Y10T 428/15 (2015.01); Y10T 428/21 (2015.01);
Abstract
The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.