The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

C09J 7/02 (2006.01); H01L 21/04 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); C09J 165/00 (2006.01);

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Abstract

The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

Find Patent Forward Citations

Takamoto, Naohide. (2017). Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production (U.S. Patent No. 9761475). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9761475

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile