The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Jul. 27, 2011
Yusuke Komoto, Osaka, JP;
Naohide Takamoto, Osaka, JP;
Goji Shiga, Osaka, JP;
Fumiteru Asai, Osaka, JP;
Yusuke Komoto, Osaka, JP;
Naohide Takamoto, Osaka, JP;
Goji Shiga, Osaka, JP;
Fumiteru Asai, Osaka, JP;
NITTO DENKO CORPORATION, Osaka, JP;
Abstract
The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile