Nitto-denko Corporation

Nittok Denko Corporation

Yasuhiro Amano

Yoshio Terada

Daisuke Uenda

Takeshi Matsumura

Sadahito Misumi

Naohide Takamoto

Hirofumi Fujii

Makoto Namikawa

Akihisa Murata

Yukio Arimitsu

Eiji Toyoda

Hitoshi Ishizaka

Jirou Nukaga

Yuta Kimura

Nobuaki Maruoka

Miki Morita

Masami Oikawa

Asami Funatsu

Tsubasa Miki

The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1&#xd7;10&#x3a9;&#xb7;cm or more and 1&#xd7;10&#x3a9;&#xb7;cm or less, and the tensile storage modulus of the thermosetting type die bond film at &#x2212;20&#xb0; C. before thermal curing is 0.1 to 10 GPa.

Dicing die bond film

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mmis 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

A dicing die-bonding film in which the adhesive properties during the dicing step and the peeling properties during the pickup step are controlled so that both become good, and a production method thereof, are provided. The dicing die-bonding film in the present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material and a die bond layer on the pressure-sensitive adhesive layer, in which the arithmetic mean roughness X (&#x3bc;m) on the pressure-sensitive adhesive layer side in the die bond layer is 0.015 &#x3bc;m to 1 &#x3bc;m, the arithmetic mean roughness Y (&#x3bc;m) on the die bond layer side in the pressure-sensitive adhesive layer is 0.03 &#x3bc;m to 1 &#x3bc;m, and the absolute value of the difference of the X and Y is 0.015 or more.

Dicing/die bonding film

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mmas determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa&#xb7;s or more and 2500 Pa&#xb7;s or less at 100&#xb0; C. before the film is thermally set.

Thermosetting die bonding film

The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20&#xb0; C. up to 150&#xb0; C. being 5&#xd7;10Pa to 1&#xd7;10Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor

Adhesive film material for use in manufacturing semiconductors

Growing community of inventors

Ibaraki, Japan

Yasuhiro Amano