Yanbo Xu

Title: Yanbo Xu: Innovator in Semiconductor Technology

Introduction

Yanbo Xu is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative semiconductor devices that enhance performance and efficiency.

Latest Patents

Among his latest patents is the "Exposed die power semiconductor device." This invention features a semiconductor package that includes a lead frame and a power die. The lead frame is designed with a first die paddle that has a cavity formed entirely through it. The power die is mounted on this paddle, with a portion of its lower surface attached using a solderless die-attach adhesive, while another portion remains exposed, abutting the cavity.

Another notable patent is the "Integrated circuit package having side and bottom contact pads." This packaged integrated circuit device comprises a substrate module, leads, and an IC die with two sets of die contact pads. The substrate module features conductive contacts on both its upper and lower surfaces, facilitating electrical connections. Certain embodiments of this invention allow for multi-form packaged devices that support various types of external connections, such as BGA and QFN.

Career Highlights

Yanbo Xu is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the capabilities of integrated circuits and semiconductor devices.

Collaborations

Throughout his career, Yanbo has collaborated with notable colleagues, including Zhijie Wang and Fei Zong. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Yanbo Xu's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative designs continue to shape the future of electronic devices.