The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Nov. 24, 2014
Applicants:
Yanbo Xu, Tianjin, CN;
Zhijie Wang, Tianjin, CN;
Fei Zong, Tianjin, CN;
Inventors:
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49572 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/50 (2013.01); H01L 23/49568 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15157 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18165 (2013.01);
Abstract
A semiconductor package has a lead frame and a power die. The lead frame has a first die paddle with a cavity formed entirely therethrough. The power die, which has a lower surface, is mounted on the first die paddle such that a first portion of the lower surface is attached to the first die paddle using a solderless die-attach adhesive, and a second portion of the lower surface, is not attached to the first die paddle and abuts the cavity formed in the first die paddle such that the second portion is exposed.