The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Jun. 06, 2012
Applicants:
Quan Chen, Tianjin, CN;
Wei Gai, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for receiving a lead frame array that includes semiconductor dies for encapsulation. The cavities are aligned in spaced, vertical columns and gates are provided at the opening of each column of cavities. A molding compound is passed through the gates and flows uninterrupted through each cavity and encapsulates the semiconductor dies.