The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Nov. 23, 2014
Zhijie Wang, Tianjin, CN;
Zhigang Bai, Tianjin, CN;
Aipeng Shu, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Huchang Zhang, Tianjin, CN;
Fei Zong, Tianjin, CN;
Zhijie Wang, Tianjin, CN;
Zhigang Bai, Tianjin, CN;
Aipeng Shu, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Huchang Zhang, Tianjin, CN;
Fei Zong, Tianjin, CN;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material.