The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Nov. 23, 2014
Zhijie Wang, Tianjin, CN;
Zhigang Bai, Tianjin, CN;
Aipeng Shu, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Huchang Zhang, Tianjin, CN;
Fei Zong, Tianjin, CN;
Zhijie Wang, Tianjin, CN;
Zhigang Bai, Tianjin, CN;
Aipeng Shu, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Huchang Zhang, Tianjin, CN;
Fei Zong, Tianjin, CN;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.