The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Nov. 26, 2014
Jianshe BI, Tianjin, CN;
Lanping Bai, Tianjin, CN;
Quan Chen, Tianjin, CN;
Liping Guo, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Jianshe Bi, Tianjin, CN;
Lanping Bai, Tianjin, CN;
Quan Chen, Tianjin, CN;
Liping Guo, Tianjin, CN;
Yanbo Xu, Tianjin, CN;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.