Company Filing History:
Years Active: 2015-2016
Title: Jianshe Bi: Innovator in Integrated Circuit Packaging
Introduction
Jianshe Bi is a notable inventor based in Tianjin, China. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on enhancing the efficiency and reliability of electronic devices through innovative packaging solutions.
Latest Patents
One of Jianshe Bi's latest patents is titled "Integrated circuit package having side and bottom contact pads." This invention describes a packaged integrated circuit device that includes a substrate module, leads, an IC die with first and second sets of die contact pads, and an encapsulant. The substrate module features upper and lower sets of conductive contacts on its surfaces, ensuring electrical connectivity between the die contact pads and the leads. This design allows for a multi-form packaged device that supports various external connections, such as BGA and QFN.
Another significant patent is "Protective packaging for integrated circuit device." This method revolutionizes the traditional packaging process by replacing multiple manufacturing steps with a single thermal treatment. This approach not only forms proper electrical connections for the die but also encapsulates it in a protective enclosure, enhancing the durability of the integrated circuit.
Career Highlights
Jianshe Bi is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the field of semiconductor technology. His expertise in integrated circuit packaging has positioned him as a valuable asset to the company.
Collaborations
Throughout his career, Jianshe Bi has collaborated with talented individuals such as Yanbo Xu and Jinsheng Wang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Jianshe Bi's contributions to integrated circuit packaging demonstrate his commitment to advancing technology in the semiconductor industry. His innovative patents reflect a deep understanding of the complexities involved in electronic device manufacturing.