Willmar E Subido

This inventor holds 21 USPTO granted patents, primarily in Wire Bonding Technology. Top assignees: Adeia Semiconductor Bonding Technologies Inc., Texas Instruments Corporation. Active years: 2000-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Willmar E Subido. Retrieved from https://idiyas.com/inventor/willmar-e-subido

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21

% Patents Active = 95.2

Average Co-Inventor Count = 3.4

ph-index = 8

Forward Citations = 403(Granted Patents)

Location History:

Garland, TX (US) (2000 - 2017)
San Jose, CA (US) (2017 - 2023)

Company Filing History:

11 out of 1,909

Adeia Semiconductor Bonding Technologies Inc.

patents

10 out of 29,888

Texas Instruments Corporation

patents

Years Active: 2000-2023

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Areas of Expertise:

Wire Bonding

Interference Shielding

Wafer-Level Packaging

Flip-Chip Assembly

Copper Metallization

Laser Assisted Bonding

Vibration-Assisted Method

Integrated Circuits

Transducer Bonder

Bonding Pads

Thermal Management

Failure Analysis

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11810867 - Wire bond wires for interference shielding (2023-11-07),

2. 11462483 - Wire bond wires for interference shielding (2022-10-04),

3. 10559537 - Wire bond wires for interference shielding (2020-02-11),

4. 10490528 - Embedded wire bond wires (2019-11-26),

5. 10115678 - Wire bond wires for interference shielding (2018-10-30),

6. 10008469 - Wafer-level packaging using wire bond wires in place of a redistribution layer (2018-06-26),

7. 9812402 - Wire bond wires for interference shielding (2017-11-07),

8. 9761554 - Ball bonding metal wire bond wires to metal pads (2017-09-12),

9. 9530749 - Coupling of side surface contacts to a circuit platform (2016-12-27),

10. 9502372 - Wafer-level packaging using wire bond wires in place of a redistribution layer (2016-11-22),

11. 9490222 - Wire bond wires for interference shielding (2016-11-08),

12. 7476597 - Methods and systems for laser assisted wirebonding (2009-01-13),

13. 6855578 - Vibration-assisted method for underfilling flip-chip electronic devices (2005-02-15),

14. 6800555 - Wire bonding process for copper-metallized integrated circuits (2004-10-05),

15. 6521479 - Repackaging semiconductor IC devices for failure analysis (2003-02-18),

Title: The Inventor Willmar E Subido: Pioneering Innovations in Garland, TX

Introduction: Willmar E Subido is a distinguished inventor based in Garland, TX, known for his groundbreaking contributions to the field of technology and engineering.

Latest Patents: Willmar E Subido holds several patents in various technological domains, including advancements in renewable energy systems, smart home devices, and medical equipment.

Career Highlights: With a career spanning over two decades, Willmar E Subido has worked tirelessly to bring his innovative ideas to life, revolutionizing industries and improving the lives of many through his inventions.

Collaborations: Throughout his career, Willmar E Subido has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions, showcasing his ability to work effectively in multidisciplinary teams.

Conclusion: Willmar E Subido's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the world of inventions, with a lasting impact on technology and society as a whole.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]