logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9530749 B1

PDFFull Text
Date of Patent:
Dec. 27, 2016

Filed:

Apr. 28, 2015

Coupling of side surface contacts to a circuit platform

Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Reynaldo Co, Santa Cruz, CA (US);

Willmar Subido, Garland, TX (US);

Hoang Nguyen, Santa Cruz, CA (US);

Marjorie Cara, Tracy, CA (US);

Wael Zohni, San Jose, CA (US);

Christopher W. Lattin, San Jose, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:

David S Blum

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); B23K 20/004 (2013.01); B81B 7/007 (2013.01); B81C 1/00301 (2013.01); H01L 24/85 (2013.01); B81B 2207/05 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/85203 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.

Find Patent Forward Citations

Loading…