Location History:
- Scotts Valley, CA (US) (2011 - 2015)
- Santa Cruz, CA (US) (2013 - 2023)
Company Filing History:
32 out of 1,855 
2 out of 10 
1 out of 19 Years Active: 2011-2025
Title: Reynaldo Co: Innovator in Microelectronic Package Technology
Introduction
Reynaldo Co, based in Santa Cruz, CA, has made significant contributions to the field of microelectronics through his impressive portfolio of 36 patents. His innovative work primarily focuses on advancements in package-on-package assembly technologies, a critical area in the continuous miniaturization of electronic components.
Latest Patents
Among his latest innovations is a patent concerning a package-on-package assembly with wire bond vias. This microelectronic package showcases a substrate hosting a microelectronic element, complete with exposed electrically conductive elements on its surface. The patent details a sophisticated arrangement of wire bonds, with their bases bound to conductive elements and tips smaller than the first diameters of the bonds. This design allows for enhanced electrical connection integrity while incorporating a dielectric encapsulation layer that protects key portions of the wire bonds, ensuring reliability in microelectronic applications.
Career Highlights
Co has accumulated valuable experience during his professional journey with reputable companies such as Adeia Semiconductor Bonding Technologies Inc. and Vertical Circuits, Inc. His roles at these organizations have enabled him to refine his skills in microelectronic packaging, solidifying his reputation as an expert in the field.
Collaborations
Throughout his career, Reynaldo Co has worked alongside notable professionals like Ellis Chau and Philip Damberg. These collaborations have fostered an environment of innovation and shared expertise, contributing to the advancements made in microelectronic packaging technology.
Conclusion
Reynaldo Co stands out as an influential inventor in the microelectronics domain, with his inventive spirit and significant contributions reflected in his numerous patents. His dedication and collaboration with industry experts continue to push the boundaries of technology, paving the way for future innovations in electronic packaging solutions.