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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9893033 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Apr. 12, 2016

Off substrate kinking of bond wire

Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Reynaldo Co, Santa Cruz, CA (US);

Rizza Lee Saga Cizek, Brentwood, CA (US);

Wael Zohni, San Jose, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:

Lerner, David, Littenberg, Krumholz & Mentlik, LLP

Primary Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); B23K 20/004 (2013.01); B23K 20/005 (2013.01); B23K 20/007 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/49811 (2013.01); H01L 24/43 (2013.01); H01L 24/78 (2013.01); H01L 2224/056 (2013.01); H01L 2224/432 (2013.01); H01L 2224/4382 (2013.01); H01L 2224/43985 (2013.01); H01L 2224/783 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78621 (2013.01); H01L 2224/78822 (2013.01); H01L 2224/85 (2013.01); H01L 2224/85345 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/2064 (2013.01);
Abstract

An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.

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