The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
May. 19, 2016
Invensas Corporation, San Jose, CA (US);
Reynaldo Co, Santa Cruz, CA (US);
Laura Mirkarimi, Sunol, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A microelectronic assembly () includes a substrate () having a first and second opposed surfaces. A microelectronic element () overlies the first surface and first electrically conductive elements () can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements () are electrically connected to the microelectronic element (). Wire bonds () have bases () joined to the conductive elements () and end surfaces () remote from the substrate and the bases, each wire bond defining an edge surface () extending between the base and the end surface. An encapsulation layer () can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds () are defined by at least portions of the end surfaces () of the wire bonds that are uncovered by the encapsulation layer ().