The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Jul. 10, 2015
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Willmar Subido, Garland, TX (US);
Reynaldo Co, Santa Cruz, CA (US);
Wael Zohni, San Jose, CA (US);
Ashok S. Prabhu, San Jose, CA (US);
Assignee:
Invensas Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/45 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45616 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/8501 (2013.01); H01L 2224/85207 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/20105 (2013.01);
Abstract
An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.