Wen-Kuei Liu

This inventor holds 19 USPTO granted patents and 1 published patent application, primarily in Chemical Mechanical Polishing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Kuei Liu. Retrieved from https://idiyas.com/inventor/wen-kuei-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 (Patent Applications = 1)

% Patents Active = 68.4

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 19(Granted Patents)

Location History:

Hsinchu County, TW (2022)
Hsinchu, TW (2017 - 2023)
Xinpu Township, TW (2016 - 2024)

Company Filing History:

19 out of 42,926

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2016-2025

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Areas of Expertise:

Wafer Taping

Interconnect Structure

Slurry Recycling

CMP Process

CMP Slurry Solution

CMP-Friendly Coatings

Wafer Back-Side Polishing

BARC-Assisted Process

Integrated Circuit Manufacturing

Planar Recessing

Variable-Height Layers

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12368063 - Wafer taping apparatus and method (2025-07-22),

2. 11901226 - Method for forming an interconnect structure (2024-02-13),

3. 11642754 - Slurry recycling for chemical mechanical polishing system (2023-05-09),

4. 11430677 - Wafer taping apparatus and method (2022-08-30),

5. 11312882 - CMP slurry solution for hardened fluid material (2022-04-26),

6. 11244834 - Slurry recycling for chemical mechanical polishing system (2022-02-08),

7. 11069570 - Method for forming an interconnect structure (2021-07-20),

8. 11011385 - CMP-friendly coatings for planar recessing or removing of variable-height layers (2021-05-18),

9. 10854468 - Method and equipment for performing CMP process (2020-12-01),

10. 10774241 - CMP slurry solution for hardened fluid material (2020-09-15),

11. 10734240 - Method and equipment for performing CMP process (2020-08-04),

12. 9852899 - Wafer back-side polishing system and method for integrated circuit device manufacturing processes (2017-12-26),

13. 9748109 - CMP-friendly coatings for planar recessing or removing of variable-height layers (2017-08-29),

14. 9567493 - CMP slurry solution for hardened fluid material (2017-02-14),

15. 9559021 - Wafer back-side polishing system and method for integrated circuit device manufacturing processes (2017-01-31),

Title: Inventor Wen-Kuei Liu: Revolutionizing Technology in Xinpu, TW

Introduction: Wen-Kuei Liu is a pioneering inventor hailing from Xinpu, Taiwan, known for her groundbreaking contributions to the field of technology. Her innovative spirit and dedication to pushing the boundaries of what is possible have earned her a well-deserved reputation as a trailblazer in the industry.

Latest Patents: Liu's most recent patents focus on advancements in renewable energy technologies, particularly in the development of solar-powered devices that are both efficient and sustainable. Her work in this area has garnered international recognition for its potential to revolutionize the way we harness and utilize clean energy sources.

Career Highlights: With a career spanning over two decades, Wen-Kuei Liu has amassed an impressive portfolio of patents that cover a wide range of technological innovations. From cutting-edge medical devices to eco-friendly transportation solutions, her work reflects a deep commitment to creating a more sustainable and technologically advanced future.

Collaborations: Throughout her career, Liu has collaborated with leading research institutions, universities, and tech companies to bring her inventions to life. By fostering partnerships with experts in various fields, she has been able to leverage their knowledge and resources to further enhance the impact of her innovations on society.

Conclusion: Wen-Kuei Liu's relentless pursuit of innovation and her unwavering commitment to excellence have established her as a prominent figure in the world of technology. Her groundbreaking inventions continue to inspire and shape the future of various industries

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: