The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Apr. 25, 2014
Kuo-yin Lin, Jhubei, TW;
Wen-kuei Liu, Hsinchu, TW;
Teng-chun Tsai, Hsinchu, TW;
Shen-nan Lee, Hsinchu, TW;
Kuo-cheng Lien, Hsinchu, TW;
Chang-sheng Lin, Hsinchu, TW;
Yu-wei Chou, Hsinchu, TW;
Kuo-Yin Lin, Jhubei, TW;
Wen-Kuei Liu, Hsinchu, TW;
Teng-Chun Tsai, Hsinchu, TW;
Shen-Nan Lee, Hsinchu, TW;
Kuo-Cheng Lien, Hsinchu, TW;
Chang-Sheng Lin, Hsinchu, TW;
Yu-Wei Chou, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;
Abstract
A method for performing a Chemical Mechanical Polishing (CMP) process includes applying a CMP slurry solution to a surface of a hardened fluid material on a substrate, the solution comprising an additive to change a bonding structure on the surface of the hardened fluid material. The method further includes polishing the surface of the hardened fluid material with a polishing head.