Taichung, Taiwan

Wei-Ming Wang

This inventor holds 25 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Ming Wang. Retrieved from https://idiyas.com/inventor/wei-ming-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Hsinchu County, TW (2021 - 2023)
  • Taichung, TW (2021 - 2024)
  • Hsinchu, TW (2021 - 2024)

Company Filing History:


Years Active: 2021-2026

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Areas of Expertise:
Semiconductor Package
Stacked Dies
Thermal Substrate
Vibration Reduction
Photonic Package
Wafer Bonding
MRAM Processing
Dielectric Film
Bonding Yield
Manufacturing Method
Processing Tool
25 patents (USPTO):Explore Patents

Title: Innovator Wei-Ming Wang: Advancements in Semiconductor Technologies

Introduction: Wei-Ming Wang, a distinguished inventor based in Taichung, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 16 patents, Wang's innovations have propelled advancements in manufacturing methods and semiconductor structures.

Latest Patents: Among his latest patents, Wei-Ming Wang has developed a semiconductor structure having a through substrate via (TSV) and the corresponding manufacturing method. This innovative semiconductor structure incorporates a dielectric layer and a conductive pad embedded within it. The design features a semiconductor substrate that includes a via opening with a notch proximate to the dielectric layer. This design ensures that the TSV extends into the dielectric layer, landing on the conductive pad, while a dielectric liner effectively separates the TSV from the semiconductor substrate.

Another notable patent is for a semiconductor package and its manufacturing method. This package comprises a substrate with an embedded ground plate, a semiconductor die electrically connected to this substrate, and a surrounding semiconductor frame structure which includes conductive through semiconductor vias (TSVs). The semiconductor cover structure also plays a critical role, featuring a conductive grid pattern that interacts with the conductive TSVs, ensuring efficient connectivity and functionality.

Career Highlights: Wei-Ming Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate and advance semiconductor technologies. His work has positioned him as a key player in the semiconductor industry, enabling enhanced design capabilities and increased performance in electronic devices.

Collaborations: Throughout his career, Wang has collaborated with other talented professionals, including Po-Shu Wang and Huei-Tsz Wang. Together, they have worked to push the boundaries of semiconductor research and development, resulting in impactful technological advancements.

Conclusion: With his impressive track record and ongoing contributions to semiconductor technology, Wei-Ming Wang exemplifies the spirit of innovation. His patents not only highlight his expertise but also signify the importance of collaborative efforts in advancing technology that shapes our digital future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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