The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jun. 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wei-Ming Wang, Taichung City, TW;
Chen Chen, New Taipei City, TW;
Chih-Hao Yu, Tainan City, TW;
Shih-Peng Tai, Xinpu Township, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of forming a semiconductor package is provided. The method includes forming a first wafer that includes multiple photonic dies. The method includes forming a second wafer that includes multiple electronic dies. The method includes forming micro lenses within the second wafer. The method includes bonding the first wafer to the second wafer after forming the plurality of micro lenses. The method further includes performing a singulation process to dice the first wafer and the second wafer to form multiple photonic packages, wherein one of the photonic packages includes an electronic die, a photonic die bonded to the electronic die, and one or more micro lenses embedded in the electronic die.