La Murette, France

Vincent Larrey

This inventor holds 19 USPTO granted patents and 3 published patent applications and 19 EPO patents, primarily in Semiconductor Bonding. Top assignees: Commissariat a L'energie Atomique Et Aux Energies Alternatives, Soitec, Freescale Semiconductor,inc.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent Larrey. Retrieved from https://idiyas.com/inventor/vincent-larrey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 78.9

 

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 39(Granted Patents)


Location History:

  • Murette, FR (2016)
  • La Murette, FR (2011 - 2021)
  • Grenoble, FR (2021)

Company Filing History:


Years Active: 2011-2026

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Areas of Expertise:
Direct Bonding
Hydrophilic Surfaces
Electromechanical Structure
Multilayer Structure
Silicon-Based Nanoelements
MEMS/NEMS Components
Cationic Elements
Suspended Membrane
Temporary Bonding
Detachable Structure
Buried Electrode
Structure with Moving Portion
19 patents (USPTO):Explore Patents

Title: **Vincent Larrey: Innovative Substrate Bonding Expert from La Murette, France**

Introduction

Vincent Larrey, an accomplished inventor from La Murette, France, has made significant contributions to the field of bonding technologies. With a remarkable portfolio of 13 patents, he specializes in methods that enhance the quality of bonding between substrates, showcasing his expertise and innovation.

Latest Patents

Among Vincent Larrey's latest inventions is the "Bonding Method with Electron-Stimulated Desorption." This advanced method involves directly bonding two substrates by removing surface oxide layers and applying hydrogen passivation. In a controlled vacuum environment, electron impact hydrogen desorption is performed on the bonding faces before placing them in intimate contact. This technique aims to improve bonding quality and reliability.

Another significant patent is the "Method and Device for Checking a Bond Between Two Substrates." This invention outlines a systematic approach to verify the integrity of bonded assemblies. It involves transmitting an ultrasonic excitation signal, measuring the resulting feedback signal, and computing a spectral signal to assess the bond's quality. This innovative method provides important information regarding the durability and performance of the bond between the substrates.

Career Highlights

Throughout his career, Vincent Larrey has worked with prestigious organizations, including the Commissariat à l'Énergie Atomique et aux Énergies Alternatives and Commissariat à l'Énergie Atomique. His engagement in these institutions allowed him to focus on cutting-edge research and development, enhancing his contributions to the field of bonding technologies.

Collaborations

Vincent's journey has included collaborations with notable professionals, including Bernard Diem and Laurent Clavelier. These partnerships have fostered a dynamic exchange of ideas and innovations, facilitating the advancement of bonding methods in various applications.

Conclusion

Vincent Larrey stands out as a dedicated inventor whose innovative patents have greatly influenced the industry of substrate bonding. His work not only reflects his technical proficiency but also contributes to the overall advancement of materials science. With ongoing research and development, Larrey continues to pave the way for new bonding technologies that promise to enhance product performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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