The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Oct. 20, 2020
Applicant:

Commissariat À L'energie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Frank Fournel, Grenoble, FR;

Aziliz Calvez, Grenoble, FR;

Gaelle Eleouet, Grenoble, FR;

Vincent Larrey, Grenoble, FR;

Christophe Morales, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); C09J 5/02 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
C09J 5/02 (2013.01); C09J 5/06 (2013.01); H01L 21/187 (2013.01);
Abstract

A method of direct bonding comprising the following steps: supplying a first substrate and a second substrate, the first substrate being covered by a first hydrophilic surface and the second substrate being covered by a second hydrophilic surface, deposition of a specific molecule on the first hydrophilic surface and/or on the second hydrophilic surface, the specific molecule comprising a hydrophilic functional group and a basic functional group, separated by at least one atom, contacting the first hydrophilic surface with the second hydrophilic surface, whereby the two hydrophilic surfaces are bonded one with the other, and the first substrate and the second substrate are assembled, optionally, application of a bonding annealing heat treatment, preferably at a temperature less than or equal to 500° C.


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